Lub luminous efficiency ntawm tobUV LEDFeem ntau yog txiav txim siab los ntawm sab nraud quantum efficiency, uas yog cuam tshuam los ntawm lub internal quantum efficiency thiab lub teeb extraction efficiency. Nrog rau kev txhim kho tas mus li (> 80%) ntawm qhov kev ua haujlwm sab hauv quantum ntawm kev sib sib zog nqus UV LED, lub teeb tshem tawm kev ua haujlwm ntawm qhov sib sib zog nqus UV LED tau dhau los ua qhov tseem ceeb txwv kev txhim kho lub teeb pom kev zoo ntawm qhov sib sib zog nqus UV LED, thiab lub teeb extraction efficiency ntawm sib sib zog nqus UV LED cuam tshuam zoo heev los ntawm kev ntim tshuab. Qhov sib sib zog nqus UV LED ntim tshuab yog txawv los ntawm cov khoom siv ntim khoom dawb tam sim no. Dawb LED feem ntau yog ntim nrog cov khoom siv organic (epoxy resin, silica gel, thiab lwm yam), tab sis vim qhov ntev ntawm qhov sib sib zog nqus UV lub teeb yoj thiab lub zog siab, cov ntaub ntawv organic yuav raug UV degradation nyob rau hauv ntev ntev UV hluav taws xob, uas cuam tshuam loj heev. lub teeb efficiency thiab kev ntseeg siab ntawm tob UV LED. Yog li ntawd, sib sib zog nqus UV LED ntim yog qhov tseem ceeb tshwj xeeb rau kev xaiv cov ntaub ntawv.

LED ntim cov ntaub ntawv feem ntau suav nrog cov khoom siv teeb pom kev zoo, cov ntaub ntawv kub dissipation substrate thiab cov khoom siv vuam sib txuas. Lub teeb emitting khoom yog siv rau nti luminescence extraction, lub teeb kev tswj, kev tiv thaiv txhua yam, thiab lwm yam; Thaum tshav kub kub dissipation substrate yog siv rau chip hluav taws xob interconnection, tshav kub dissipation thiab txhua yam kev txhawb nqa; Welding bonding cov ntaub ntawv yog siv rau chip solidification, lens bonding, thiab lwm yam.

1. Lub teeb emitting khoom:tusLED teebemitting qauv feem ntau txais cov ntaub ntawv pob tshab kom paub txog lub teeb pom kev zoo thiab kev hloov kho, thaum tiv thaiv cov nti thiab txheej txheej. Vim tias cov cua sov tsis zoo thiab tsis tshua muaj thermal conductivity ntawm cov khoom siv organic, cov cua sov tsim los ntawm qhov sib sib zog nqus UV LED nti yuav ua rau qhov kub thiab txias ntawm cov organic ntim txheej yuav nce, thiab cov khoom siv organic yuav raug thermal degradation, thermal aging thiab txawm tias carbonization irreversible. nyob rau hauv kub kub rau lub sij hawm ntev; Tsis tas li ntawd, nyob rau hauv lub zog hluav taws xob ultraviolet hluav taws xob, cov txheej ntim cov organic yuav muaj kev hloov pauv tsis tau xws li txo qis kev xa tawm thiab microcracks. Nrog rau kev nce ntxiv ntawm kev sib sib zog nqus UV zog, cov teeb meem no dhau los ua qhov hnyav dua, ua rau nws nyuaj rau cov khoom siv organic kom tau raws li qhov xav tau ntawm kev ntim khoom sib sib zog nqus UV LED. Feem ntau, txawm hais tias qee cov ntaub ntawv organic tau tshaj tawm tias muaj peev xwm tiv taus lub teeb ci ultraviolet, vim qhov tsis zoo ntawm cov cua sov thiab cov khoom siv tsis zoo airtightness, cov ntaub ntawv organic tseem txwv nyob rau hauv tob UV.LED ntim. Yog li ntawd, cov kws tshawb fawb niaj hnub sim siv cov ntaub ntawv tsis muaj pob tshab xws li quartz iav thiab sapphire los ntim tob UV LED.

2. Thaum tshav kub kub dissipation substrate cov ntaub ntawv:Tam sim no, LED kub dissipation substrate cov ntaub ntawv feem ntau muaj xws li cob, hlau thiab ceramic. Ob leeg cob thiab hlau substrates muaj cov organic resin rwb thaiv tsev txheej, uas yuav txo tau cov thermal conductivity ntawm lub tshav kub dissipation substrate thiab cuam tshuam lub tshav kub dissipation kev ua tau zoo ntawm substrate; Ceramic substrates feem ntau suav nrog kub / qis kub co raug rho tawm haujlwm ceramic substrates (HTCC / ltcc), tuab zaj duab xis ceramic substrates (TPC), tooj liab-clad ceramic substrates (DBC) thiab electroplated ceramic substrates (DPC). Ceramic substrates muaj ntau yam zoo, xws li siab mechanical zog, zoo rwb thaiv tsev, siab thermal conductivity, zoo tshav kub tsis kam, tsis tshua muaj coefficient ntawm thermal expansion thiab thiaj li nyob. Lawv tau siv dav hauv kev ntim khoom siv hluav taws xob, tshwj xeeb tshaj yog lub zog LED ntim khoom. Vim lub teeb pom kev tsis zoo ntawm qhov sib sib zog nqus UV LED, feem ntau ntawm cov khoom siv hluav taws xob tau hloov mus rau hauv tshav kub. Txhawm rau kom tsis txhob muaj kev kub ntxhov siab rau cov nti uas tshwm sim los ntawm cov cua kub ntau dhau, cov cua sov uas tsim los ntawm cov nti yuav tsum tau dissipated mus rau ib puag ncig ib puag ncig hauv lub sijhawm. Txawm li cas los xij, qhov sib sib zog nqus UV LED feem ntau tso siab rau cov cua sov dissipation substrate raws li txoj kev tshav kub. Yog li ntawd, lub siab thermal conductivity ceramic substrate yog ib qho kev xaiv zoo rau lub tshav kub dissipation substrate rau sib sib zog nqus UV LED ntim.

3. welding bonding cov ntaub ntawv:sib sib zog nqus UV LED vuam cov ntaub ntawv suav nrog cov khoom siv lead ua cov khoom siv thiab cov khoom siv hauv qab vuam, uas yog siv los ua kom paub qhov vuam ntawm nti, iav npog (lens) thiab ceramic substrate. Rau flip nti, Kub Tin eutectic txoj kev yog feem ntau siv los paub nti solidification. Rau cov kab rov tav thiab ntsug, cov kua nplaum nplaum thiab cov hmoov txhuas tsis muaj hmoov txhuas tuaj yeem siv los ua kom tiav cov chips solidification. Piv nrog cov kua nplaum nyiaj thiab cov hmoov txhuas tsis muaj hmoov txhuas, cov kub Tin eutectic bonding lub zog yog siab, lub interface zoo yog qhov zoo, thiab cov thermal conductivity ntawm cov khoom sib txuas yog siab, uas txo cov LED thermal kuj. Cov iav npog phaj yog welded tom qab lub chip solidification, yog li qhov vuam kub yog txwv los ntawm qhov kub thiab txias ntawm cov nti solidification txheej, feem ntau suav nrog kev sib txuas ncaj qha thiab kev sib txuas. Kev sib txuas ncaj qha tsis xav tau cov ntaub ntawv sib txuas nruab nrab. Txoj kev kub siab thiab kev kub siab yog siv los ua kom tiav qhov vuam ntawm lub iav npog phaj thiab cov ceramic substrate. Cov kev sib txuas sib txuas yog tiaj tus thiab muaj lub zog siab, tab sis muaj cov kev xav tau siab rau cov khoom siv thiab cov txheej txheem tswj; Solder bonding siv qhov kub thiab txias tin raws li cov txheej txheem nruab nrab. Nyob rau hauv cov xwm txheej ntawm cua sov thiab lub siab, kev sib txuas yog ua tiav los ntawm kev sib koom ua ke ntawm cov atoms ntawm cov txheej txheem thiab cov txheej hlau. Cov txheej txheem kub yog qis thiab kev ua haujlwm yooj yim. Tam sim no, solder bonding feem ntau yog siv los paub txog kev ruaj ntseg ntawm cov iav npog phaj thiab ceramic substrate. Txawm li cas los xij, cov txheej hlau yuav tsum tau npaj rau saum npoo ntawm iav npog phaj thiab ceramic substrate nyob rau tib lub sijhawm kom ua tau raws li cov kev cai ntawm cov hlau vuam, thiab cov kev xaiv ntawm solder, txheej txheej, solder overflow thiab vuam kub yuav tsum tau xav txog nyob rau hauv cov txheej txheem sib txuas. .

Nyob rau hauv xyoo tas los no, cov kws tshawb fawb hauv tsev thiab txawv teb chaws tau ua qhov kev tshawb fawb tob tob txog UV LED ntim cov ntaub ntawv, uas tau txhim kho lub teeb pom kev zoo thiab kev ntseeg siab ntawm kev sib sib zog nqus UV LED los ntawm kev xav ntawm ntim cov khoom siv technology, thiab txhawb kev loj hlob ntawm kev sib sib zog nqus UV. LED technology.